Title :
Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium
Abstract :
The following topics were dealt with: conductive adhesives, lead-free interconnects, and no-clean soldering; inspection and testing; surface mount technology; manufacturing management; flip chip technology; flat panel displays; modeling and statistical methods; fine pitch interconnect and multichip packages; manufacturing information and control systems; manufacturing globalization; manufacturing issues for ball grid array packages; manufacturing process improvement
Keywords :
adhesion; conducting polymers; economics; electronic equipment manufacture; electronic equipment testing; environmental factors; fine-pitch technology; flat panel displays; flip-chip devices; industrial control; inspection; integrated circuit packaging; manufacturing data processing; multichip modules; production engineering computing; soldering; surface mount technology; ball grid array packages; conductive adhesives; fine pitch interconnect; flat panel displays; flip chip technology; inspection; lead-free interconnects; manufacturing globalization; manufacturing management; manufacturing process improvement; modeling; multichip packages; no-clean soldering; statistical methods; surface mount technology; testing;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA, USA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404700
