DocumentCode
3040524
Title
Fundamental study on moisture absorption in epoxy for electronic application
Author
Luo, Shijian ; Wong, C.P. ; Leisen, Johannes
Author_Institution
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2001
fDate
2001
Firstpage
293
Lastpage
298
Abstract
This paper presents a fundamental study of moisture absorption in epoxy materials. Solid state nuclear magnetic resonance (NMR) techniques (both 1H NMR and 2H NMR) were used to study the binding states of water within two epoxy formulations along with the possible plasticizing effects of moisture affecting the mobility of polymer chains. Absorbed water reduces the glass transition temperature. However, the presence of moisture has no significant effect on the polymer chain mobility at temperatures below the reduced glass transition temperature. Water in an epoxy in its rubbery state above the glass transition has a much higher mobility than in a polymer in its glassy state. The mobility of water absorbed by a polymer in its rubbery state is similar to that of pure water
Keywords
adsorption; glass transition; moisture; nuclear magnetic resonance; packaging; plasticity; polymers; H2O; absorbed water; electronic application; epoxy; epoxy formulations; epoxy materials; glass transition temperature; glassy state; moisture; moisture absorption; plasticizing effects; polymer chain mobility; rubbery state; solid state NMR techniques; solid state nuclear magnetic resonance techniques; water binding states; water mobility; Absorption; Electronics packaging; Glass; Hybrid integrated circuits; Materials science and technology; Mechanical factors; Moisture; Nuclear magnetic resonance; Polymers; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-930815-64-5
Type
conf
DOI
10.1109/ISAOM.2001.916591
Filename
916591
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