• DocumentCode
    3040524
  • Title

    Fundamental study on moisture absorption in epoxy for electronic application

  • Author

    Luo, Shijian ; Wong, C.P. ; Leisen, Johannes

  • Author_Institution
    Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    293
  • Lastpage
    298
  • Abstract
    This paper presents a fundamental study of moisture absorption in epoxy materials. Solid state nuclear magnetic resonance (NMR) techniques (both 1H NMR and 2H NMR) were used to study the binding states of water within two epoxy formulations along with the possible plasticizing effects of moisture affecting the mobility of polymer chains. Absorbed water reduces the glass transition temperature. However, the presence of moisture has no significant effect on the polymer chain mobility at temperatures below the reduced glass transition temperature. Water in an epoxy in its rubbery state above the glass transition has a much higher mobility than in a polymer in its glassy state. The mobility of water absorbed by a polymer in its rubbery state is similar to that of pure water
  • Keywords
    adsorption; glass transition; moisture; nuclear magnetic resonance; packaging; plasticity; polymers; H2O; absorbed water; electronic application; epoxy; epoxy formulations; epoxy materials; glass transition temperature; glassy state; moisture; moisture absorption; plasticizing effects; polymer chain mobility; rubbery state; solid state NMR techniques; solid state nuclear magnetic resonance techniques; water binding states; water mobility; Absorption; Electronics packaging; Glass; Hybrid integrated circuits; Materials science and technology; Mechanical factors; Moisture; Nuclear magnetic resonance; Polymers; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-930815-64-5
  • Type

    conf

  • DOI
    10.1109/ISAOM.2001.916591
  • Filename
    916591