• DocumentCode
    3040557
  • Title

    Influence of titanate and zirconate coupling agents in epoxy underfill material

  • Author

    Luo, Shijian ; Yamashita, Tsuyoshi ; Wong, C.P.

  • Author_Institution
    Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    312
  • Lastpage
    317
  • Abstract
    This paper presents an investigation of the effects of five titanate and zirconate coupling agents (CA) with different functional groups on various properties of epoxy underfill materials, including viscosity, curing, thermo-mechanical properties, and adhesion to SiO2 passivation. CA-A, CA-C, and CA-E increased the viscosity of underfill. Addition of the coupling agents led to decrease in the curing onset temperature of epoxy underfill formulations. All of the coupling agents investigated in this study also brought a slight decrease in glass transition temperature (Tg) of epoxy underfill. The die shear test of underfill on SiO2 passivation showed that the adhesion was not changed significantly with the addition of the titanate and zirconate coupling agents, except for CA-E. The influence of coupling agent CA-E concentration in underfill materials was further investigated. CA-E has potential for use in epoxy underfill to improve adhesion
  • Keywords
    adhesion; encapsulation; flip-chip devices; glass transition; heat treatment; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; passivation; polymer films; shear strength; viscosity; SiO2; SiO2 passivation; adhesion; coupling agent concentration; coupling agent functional groups; curing; curing onset temperature; die shear test; epoxy underfill material; epoxy underfill materials; glass transition temperature; thermo-mechanical properties; titanate coupling agents; underfill materials; viscosity; zirconate coupling agents; Adhesives; Assembly; Curing; Delamination; Joining materials; Passivation; Soldering; Temperature; Titanium compounds; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-930815-64-5
  • Type

    conf

  • DOI
    10.1109/ISAOM.2001.916594
  • Filename
    916594