DocumentCode
3040557
Title
Influence of titanate and zirconate coupling agents in epoxy underfill material
Author
Luo, Shijian ; Yamashita, Tsuyoshi ; Wong, C.P.
Author_Institution
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2001
fDate
2001
Firstpage
312
Lastpage
317
Abstract
This paper presents an investigation of the effects of five titanate and zirconate coupling agents (CA) with different functional groups on various properties of epoxy underfill materials, including viscosity, curing, thermo-mechanical properties, and adhesion to SiO2 passivation. CA-A, CA-C, and CA-E increased the viscosity of underfill. Addition of the coupling agents led to decrease in the curing onset temperature of epoxy underfill formulations. All of the coupling agents investigated in this study also brought a slight decrease in glass transition temperature (Tg) of epoxy underfill. The die shear test of underfill on SiO2 passivation showed that the adhesion was not changed significantly with the addition of the titanate and zirconate coupling agents, except for CA-E. The influence of coupling agent CA-E concentration in underfill materials was further investigated. CA-E has potential for use in epoxy underfill to improve adhesion
Keywords
adhesion; encapsulation; flip-chip devices; glass transition; heat treatment; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; passivation; polymer films; shear strength; viscosity; SiO2; SiO2 passivation; adhesion; coupling agent concentration; coupling agent functional groups; curing; curing onset temperature; die shear test; epoxy underfill material; epoxy underfill materials; glass transition temperature; thermo-mechanical properties; titanate coupling agents; underfill materials; viscosity; zirconate coupling agents; Adhesives; Assembly; Curing; Delamination; Joining materials; Passivation; Soldering; Temperature; Titanium compounds; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-930815-64-5
Type
conf
DOI
10.1109/ISAOM.2001.916594
Filename
916594
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