DocumentCode :
3040634
Title :
Resistance of conductive adhesive joints on non-noble surface finishes
Author :
Ivanov, Vitalii ; Boehme, Bjoern ; Wolter, Klaus Juergen
Author_Institution :
Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany
fYear :
2012
fDate :
9-13 May 2012
Firstpage :
254
Lastpage :
259
Abstract :
Electrically conductive adhesives (ECAs) have number of advantages comparing to solder joints. They are environmentally friendly and have lower processing temperature that makes them suitable for manufacturing of LCD´s or connecting flexible solar cell arrays in modules. However, in flexible solar cells the metal contact is usually made of non-noble metal, and this joint can suffer from decrease of conductivity at the operation environment. In this work the joint behavior between different metal surfaces (Au, Sn, Mo) and ECAs during different ageing conditions is investigated. The aim of the work is to investigate the degradation of non-noble metal-ECA joints in order to predict the reliability of such an electrical contact. The results of the literature review and ageing experiments are presented. The ageing conditions were 120 °C thermal ageing and damp heat test (85 °C/85RH). The test samples were manufactured on FR-4-boards with metal stripes and applied ECAs between them. The experiments are focused on the electrical conductivity. The experiments have shown significant increase in joint resistance after 85 °C/85RH, while under 120 °C ageing a slight decrease was observed.
Keywords :
ageing; conductive adhesives; electrical conductivity; electrical contacts; gold alloys; molybdenum alloys; reliability; surface finishing; tin alloys; Au; FR-4-boards; LCD; Mo; Sn; ageing conditions; conductive adhesive joint resistance; damp heat test; electrical conductivity; electrical contact; electrically conductive adhesives; flexible solar cell arrays; metal contact; metal stripes; metal surfaces; nonnoble metal; nonnoble metal-ECA joints; nonnoble surface finishes; reliability; solder joints; temperature 120 degC; temperature 85 degC; thermal ageing; Aging; Contact resistance; Joints; Nickel; Resistance; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), 2012 35th International Spring Seminar on
Conference_Location :
Bad Aussee
ISSN :
2161-2528
Print_ISBN :
978-1-4673-2241-6
Electronic_ISBN :
2161-2528
Type :
conf
DOI :
10.1109/ISSE.2012.6273082
Filename :
6273082
Link To Document :
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