• DocumentCode
    3040843
  • Title

    Colloidal processing of polymer ceramic nanocomposites for integral capacitors

  • Author

    Windlass, Hitesh ; Raj, P. Markondeya ; Balaraman, Devarajan ; Bhattacharya, Swapan K. ; Tummala, Rao R.

  • Author_Institution
    Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    393
  • Lastpage
    398
  • Abstract
    Polymer ceramic composites form a suitable material system for low temperature fabrication of embedded capacitors appropriate for MCM-L technology. Improved electrical properties such as permittivity can be achieved by efficient filling of polymers with high dielectric constant ceramic powders such as lead magnesium niobate-lead titanate (PMNPT) and barium titanate (BT). Photodefinable epoxies as the matrix polymer allow fine feature definition of the capacitor elements by conventional lithography techniques. The optimum weight percent of dispersant is tuned by monitoring the viscosity of the suspension. The dispersion mechanism (steric and electrostatic contributions) in a slightly polar solvent such as PGMEA is investigated from electrophoretic measurements. A high positive zeta potential is observed in the suspension, which suggests a strong contribution of electrostatic stabilization. By optimizing the particle packing using a bimodal distribution and modified processing methodology, dielectric constant greater than 135 was achieved (PMN-PT-epoxy). Suspensions are made with the lowest PGMEA content to ensure the efficiency of the dispersion and efficient particle packing in the dried film. Improved colloidal processing of nanoparticle-filled epoxy is a promising method to obtain ultra-thin capacitor films (<2 μm) with high capacitance density and improved yield. Capacitance of 35 nF/cm2 was achieved with the thinnest films (2.5-3.0 μm)
  • Keywords
    ceramics; colloids; electrokinetic effects; electrophoresis; filled polymers; integrated circuit packaging; multichip modules; nanostructured materials; optical polymers; permittivity; photolithography; powder technology; process monitoring; suspensions; thin film capacitors; viscosity; 2 micron; 2.5 to 3 micron; BT powder; BaTiO3; MCM-L technology; PGMEA content; PGMEA polar solvent; PMNPT powder; PbMgNbO3-PbTiO3; barium titanate powder; bimodal distribution; capacitance; capacitance density; capacitor elements; colloidal processing; device yield; dielectric constant; dispersant; dispersion efficiency; dispersion mechanism; dried film; electrical properties; electrophoretic measurements; electrostatic contribution; electrostatic stabilization; embedded capacitors; fine feature definition; high dielectric constant ceramic powders; integral capacitors; lead magnesium niobate-lead titanate powder; lithography techniques; low temperature fabrication; modified processing methodology; nanoparticle-filled epoxy; particle packing; particle packing optimization; permittivity; photodefinable epoxy matrix polymer; polymer ceramic composites; polymer ceramic nanocomposites; polymer filling; positive zeta potential; steric contribution; suspension viscosity; ultra-thin capacitor films; Capacitance; Capacitors; Ceramics; Composite materials; Dielectric materials; Electrostatics; Nanocomposites; Polymers; Temperature; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-930815-64-5
  • Type

    conf

  • DOI
    10.1109/ISAOM.2001.916608
  • Filename
    916608