Pressure sensing: A novel method for characterizing the processing zone in Vapour Phase Soldering systems

Vapour Phase Soldering (VPS) [1] has become a significant alternative method for reflow soldering in the last years [2-3]. Since the technology is based on heat transfer principles, which are totally different from the conventional reflow technologies (forced convection or IR), a new approach is needed for the characterization of the processing zone inside the vapour chamber. This paper presents the results of a novel method for characterization: the measurement of pressure differences in the processing zone of a VPS tank. For this purpose, high resolution pressure sensors were applied to a batch type, experimental VPS station. High resolution of the measurement range is a key factor of the method due to the small pressure differences of the process. The measurements correlate to the Galden vapour density and the temperature, which are also important aspects of the experiment.