• DocumentCode
    3041114
  • Title

    Current thermoelectric materials and an evaluation of thermoelectric materials contacting approaches

  • Author

    Atassi, Ibrahim ; Bauer, E. ; Nicolics, J. ; Dangl, B. ; Spendlhofer, L. ; Knospe, D. ; Faistauer, F.

  • Author_Institution
    Dept. of Appl. Electron. Mater., Vienna Univ. of Technol., Vienna, Austria
  • fYear
    2012
  • fDate
    9-13 May 2012
  • Firstpage
    70
  • Lastpage
    75
  • Abstract
    In this paper a brief selection of state-of-the-art thermoelectric materials is described which are used for thermoelectric power generation. A summary of current advances in the field of thermoelectric (TE) materials which are used for TE power generation is presented. Among them, the class of filled skutterudite is very promising and extensively investigated. Skutterudites offer good power conversion efficiencies, with the high temperature side of the generators reaching up to 600 °C. Higher temperatures result in technological challenges related to thermomechanically induced stress. Additional difficulties at high temperatures can arise with respect to the reliability of the electrical contacts between the TE materials and metal connectors. Some contacting metals (e.g. silver) tend to diffuse into the active thermoelectric legs and thus are unsuitable for various high-temperature TE materials. As a first step towards a cascaded TE heat engine two Bi2Te3 based TE generators have been evaluated with respect to the influence of TE-leg contacting approaches by measuring their figure-of-merit. While the elements of one TE generator were attached by means of vapor phase bonding using a tin based solder, the elements of the second generator were attached with a silver filled epoxy adhesive.
  • Keywords
    adhesives; bismuth compounds; electric connectors; electrical contacts; reliability; silver; solders; thermoelectric conversion; Ag; Bi2Te3; cascaded TE heat engine; electrical contacts; filled skutterudite; metal connectors; reliability; silver filled epoxy adhesive; thermoelectric materials contacting; thermoelectric power generation; thermomechanically induced stress; tin based solder; vapor phase bonding; Heating; Iron; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2012 35th International Spring Seminar on
  • Conference_Location
    Bad Aussee
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4673-2241-6
  • Electronic_ISBN
    2161-2528
  • Type

    conf

  • DOI
    10.1109/ISSE.2012.6273111
  • Filename
    6273111