DocumentCode
3041114
Title
Current thermoelectric materials and an evaluation of thermoelectric materials contacting approaches
Author
Atassi, Ibrahim ; Bauer, E. ; Nicolics, J. ; Dangl, B. ; Spendlhofer, L. ; Knospe, D. ; Faistauer, F.
Author_Institution
Dept. of Appl. Electron. Mater., Vienna Univ. of Technol., Vienna, Austria
fYear
2012
fDate
9-13 May 2012
Firstpage
70
Lastpage
75
Abstract
In this paper a brief selection of state-of-the-art thermoelectric materials is described which are used for thermoelectric power generation. A summary of current advances in the field of thermoelectric (TE) materials which are used for TE power generation is presented. Among them, the class of filled skutterudite is very promising and extensively investigated. Skutterudites offer good power conversion efficiencies, with the high temperature side of the generators reaching up to 600 °C. Higher temperatures result in technological challenges related to thermomechanically induced stress. Additional difficulties at high temperatures can arise with respect to the reliability of the electrical contacts between the TE materials and metal connectors. Some contacting metals (e.g. silver) tend to diffuse into the active thermoelectric legs and thus are unsuitable for various high-temperature TE materials. As a first step towards a cascaded TE heat engine two Bi2Te3 based TE generators have been evaluated with respect to the influence of TE-leg contacting approaches by measuring their figure-of-merit. While the elements of one TE generator were attached by means of vapor phase bonding using a tin based solder, the elements of the second generator were attached with a silver filled epoxy adhesive.
Keywords
adhesives; bismuth compounds; electric connectors; electrical contacts; reliability; silver; solders; thermoelectric conversion; Ag; Bi2Te3; cascaded TE heat engine; electrical contacts; filled skutterudite; metal connectors; reliability; silver filled epoxy adhesive; thermoelectric materials contacting; thermoelectric power generation; thermomechanically induced stress; tin based solder; vapor phase bonding; Heating; Iron; Silicon germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2012 35th International Spring Seminar on
Conference_Location
Bad Aussee
ISSN
2161-2528
Print_ISBN
978-1-4673-2241-6
Electronic_ISBN
2161-2528
Type
conf
DOI
10.1109/ISSE.2012.6273111
Filename
6273111
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