DocumentCode :
3041921
Title :
Trends in single-wafer processing
Author :
Doering, R.R.
Author_Institution :
Texas Instruments Inc., Dallas, TX, USA
fYear :
1992
fDate :
2-4 June 1992
Firstpage :
2
Lastpage :
5
Abstract :
It is pointed out that one of the most significant trends in semiconductor manufacturing over the past three decades has been the gradual replacement of batch processing with single-wafer processing. Two other trends, the use of larger silicon wafers (to reduce manufacturing cost) and the necessity for more demanding process-performance specifications (to allow continued device circuit scaling), have driven this move to single-wafer equipment for many processes. It is now technically feasible to produce silicon integrated circuits with 100% single-wafer processing. In the next decade, it may also become economically feasible to do so.<>
Keywords :
elemental semiconductors; integrated circuit technology; monolithic integrated circuits; silicon; Si; device circuit scaling; manufacturing cost; monolithic IC; process-performance specifications; semiconductor manufacturing; single-wafer processing; Costs; Electronics industry; Instruments; Integrated circuit manufacture; Manufacturing automation; Manufacturing processes; Process control; Rapid thermal processing; Semiconductor device manufacture; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1992. Digest of Technical Papers. 1992 Symposium on
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-0698-8
Type :
conf
DOI :
10.1109/VLSIT.1992.200629
Filename :
200629
Link To Document :
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