Trends in single-wafer processing

Author

Doering, R.R.

Author_Institution

Texas Instruments Inc., Dallas, TX, USA

fYear

1992

fDate

2-4 June 1992

Firstpage

2

Lastpage

5

Abstract

It is pointed out that one of the most significant trends in semiconductor manufacturing over the past three decades has been the gradual replacement of batch processing with single-wafer processing. Two other trends, the use of larger silicon wafers (to reduce manufacturing cost) and the necessity for more demanding process-performance specifications (to allow continued device circuit scaling), have driven this move to single-wafer equipment for many processes. It is now technically feasible to produce silicon integrated circuits with 100% single-wafer processing. In the next decade, it may also become economically feasible to do so.<>

Keywords

elemental semiconductors; integrated circuit technology; monolithic integrated circuits; silicon; Si; device circuit scaling; manufacturing cost; monolithic IC; process-performance specifications; semiconductor manufacturing; single-wafer processing; Costs; Electronics industry; Instruments; Integrated circuit manufacture; Manufacturing automation; Manufacturing processes; Process control; Rapid thermal processing; Semiconductor device manufacture; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, 1992. Digest of Technical Papers. 1992 Symposium on

Conference_Location

Seattle, WA, USA

Print_ISBN

0-7803-0698-8

Type

conf

DOI

10.1109/VLSIT.1992.200629

Filename

200629