DocumentCode
3042203
Title
Micromechanical Resonant Displacement Gain Stages
Author
Kim, B. ; Lin, Y. ; Huang, Wei-Lun ; Akgul, M. ; Li, W.-C. ; Ren, Z. ; Nguyen, C.T.-C.
Author_Institution
Dept. of EECS, Univ. of California, Berkeley, CA
fYear
2009
fDate
25-29 Jan. 2009
Firstpage
19
Lastpage
22
Abstract
Micromechanical resonant displacement gain stages have been demonstrated that employ directionally engineered stiffnesses in resonant structures to effect displacement amplification from a driven input axis to an output axis. Specifically, the introduction of slots along the output axis of a 53-MHz wine-glass mode disk resonator structure realizes a single gain stage with a measured input-to-output displacement amplification of 3.08 x. Multiple such mechanical displacement gain stages can then be cascaded in series via half-wavelength beam couplers to achieve multiplicative gain factors; e.g., two cascaded gain stages achieve a total measured gain of 7.94 x. The devices have also been operated as resonant switches, where displacement gain allows impact switching via actuation voltages of only 400 mV, which is 6 x smaller than for previous reso switches without displacement gain. The availability of such high frequency displacement gain strategies for resonant switches may soon allow purely mechanical periodic switching applications (such as power amplifiers and power converters) with much higher efficiencies than current transistor-based versions.
Keywords
VHF devices; microswitches; resonance; resonators; frequency 53 MHz; half-wavelength beam coupler; high frequency displacement gain; impact switching; mechanical displacement gain stages; mechanical periodic switching; micromechanical resonant displacement gain stages; resonant structures; resonant switches; wine glass mode disk resonator structure; Availability; Couplers; Displacement measurement; Frequency conversion; Gain measurement; Mechanical variables measurement; Micromechanical devices; Resonance; Switches; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location
Sorrento
ISSN
1084-6999
Print_ISBN
978-1-4244-2977-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2009.4805308
Filename
4805308
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