Title :
Novel MEMS Apparatus for in Situ Thermo-Mechanical Tensile Testing of Materials at the Micro- and Nano-Scale
Author :
Han, J. ; Uchic, M.D. ; Saif, T.
Author_Institution :
Univ. of Illinois at Urbana-Champaign, Urbana, IL
Abstract :
We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T > 500degC). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.
Keywords :
mechanical testing; micromechanical devices; scanning electron microscopy; thermomechanical treatment; transmission electron microscopy; MEMS; SEM; TEM; built-in thermocouple sensor; cofabricated force calibration device; elevated-temperature mechanical tensile testing; in situ thermomechanical tensile testing; test methodology; Calibration; Force measurement; Force sensors; Materials testing; Micromechanical devices; Temperature measurement; Temperature sensors; Thermal force; Thermal sensors; Thermomechanical processes;
Conference_Titel :
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location :
Sorrento
Print_ISBN :
978-1-4244-2977-6
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2009.4805324