• DocumentCode
    3042506
  • Title

    Novel MEMS Apparatus for in Situ Thermo-Mechanical Tensile Testing of Materials at the Micro- and Nano-Scale

  • Author

    Han, J. ; Uchic, M.D. ; Saif, T.

  • Author_Institution
    Univ. of Illinois at Urbana-Champaign, Urbana, IL
  • fYear
    2009
  • fDate
    25-29 Jan. 2009
  • Firstpage
    80
  • Lastpage
    83
  • Abstract
    We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T > 500degC). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.
  • Keywords
    mechanical testing; micromechanical devices; scanning electron microscopy; thermomechanical treatment; transmission electron microscopy; MEMS; SEM; TEM; built-in thermocouple sensor; cofabricated force calibration device; elevated-temperature mechanical tensile testing; in situ thermomechanical tensile testing; test methodology; Calibration; Force measurement; Force sensors; Materials testing; Micromechanical devices; Temperature measurement; Temperature sensors; Thermal force; Thermal sensors; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
  • Conference_Location
    Sorrento
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-2977-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2009.4805324
  • Filename
    4805324