DocumentCode
3042932
Title
Temperature-Controlled Transfer and Self-Wiring for Multi-Color Led Display on a Flexible Substrate
Author
Iwase, Eiji ; Onoe, Hiroaki ; Nakai, Akihito ; Matsumoto, Kiyoshi ; Shimoyama, Isao
Author_Institution
Univ. of Tokyo, Tokyo
fYear
2009
fDate
25-29 Jan. 2009
Firstpage
176
Lastpage
179
Abstract
We propose an integration method for arranging LED bare chips on a flexible substrate to fabricate a multi-color LED display. LED chips (240 mum times 240 mum times 75 mum) which were arrayed on an adhesive sheet were transferred to a flexible circuit substrate using our temperature-controlled transfer (TCT) and self-wiring (SW) method. Using these methods, we demonstrated a 5-by-5 LED flexible device and a two-color (blue and green) LED device, and observed light emission from the LED chips.
Keywords
LED displays; adhesives; flexible electronics; wiring; LED bare chip arrangement; adhesive sheet; flexible circuit substrate; flexible substrate; integration method; multicolor led display; self-wiring method; temperature-controlled transfer; Adhesives; Computer displays; Flexible printed circuits; Force control; Light emitting diodes; Self-assembly; Solids; Surface tension; Temperature; Thermal force;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location
Sorrento
ISSN
1084-6999
Print_ISBN
978-1-4244-2977-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2009.4805347
Filename
4805347
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