Glass Microprobe with Embedded Silicon Vias for 3D Integration

Author

Lin, Chiung-Wen ; Chang, Chih-Wei ; Lee, Yu-Tao ; Chen, Rongshun ; Chang, Yen-Chung ; Fang, Weileun

Author_Institution

Inst. of NanoEng. & Microsyst., Nat. Tsing Hua Univ., Hsinchu

fYear

2009

fDate

25-29 Jan. 2009

Firstpage

200

Lastpage

203

Abstract

This study presents a novel process to realize glass 2D-microprobe array. The through silicon vias (TSVs) can also be integrated with the glass 2D-microprobe using the micromachining process. The vertical integration of chips containing glass 2D-microprobe array is realized using these silicon TSVs. The 3D-microprobe array and the signal processing IC can be easily implemented after vertical assembly of 2D-microprobe chips using bonding. In application, the 2D glass microprobe is fabricated with a low impedance of 439 kOmega at 1 kHz; and the neural recording experiment has also been successfully performed on a rat.

Keywords

bioMEMS; bioelectric phenomena; biomedical electrodes; biomedical electronics; biomedical measurement; glass; integrated circuit design; microelectrodes; micromachining; neurophysiology; 2D glass microprobe array; 2D microprobe chips; 3D integration; Si; bonding; embedded silicon via; frequency 1 kHz; micromachining process; neural recording experiment; resistance 439 kohm; signal processing integrated circuit; through silicon vias; vertical chip integration; Array signal processing; Assembly; Biomedical signal processing; Electrodes; Glass; Micromachining; Probes; Shape control; Silicon; Stacking;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on

Conference_Location

Sorrento

ISSN

1084-6999

Print_ISBN

978-1-4244-2977-6

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2009.4805353

Filename

4805353