DocumentCode :
3043323
Title :
Integrated Wireless Neurostimulator
Author :
Li, W. ; Rodger, D.C. ; Tai, Y.C.
Author_Institution :
California Inst. of Technol., Pasadena, CA
fYear :
2009
fDate :
25-29 Jan. 2009
Firstpage :
248
Lastpage :
251
Abstract :
This paper presents the design, fabrication and functional testing of a fully implantable, flexible, Parylene-enabled neurostimulator that features single channel wireless stimulation capability. The system comprises a CMOS stimulator chip, a fold-and-bond RF coil, two platinum electrodes, and discrete capacitors. The MEMS components are fabricated with a Parylene-metal skin technology, and the system assembly is achieved by interconnecting individual components together on a Parylene substrate with silver epoxy. The functionality of the integrated system is verified using a telemetry link setup, and single-phase pulses with amplitudes ranging from 7 to 8.5 V are detected.
Keywords :
CMOS integrated circuits; bioMEMS; bioelectric phenomena; biomedical electrodes; neurophysiology; platinum; polymers; prosthetics; silver; wireless sensor networks; Ag; CMOS stimulator chip; Parylene substrate; Parylene-metal skin technology; Pt; bioMEMS; discrete capacitors; fold and bond RF coil; integrated wireless neurostimulator; platinum electrodes; silver epoxy; single channel wireless stimulation; CMOS technology; Capacitors; Coils; Electrodes; Fabrication; Micromechanical devices; Platinum; Radio frequency; Skin; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location :
Sorrento
ISSN :
1084-6999
Print_ISBN :
978-1-4244-2977-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2009.4805365
Filename :
4805365
Link To Document :
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