• DocumentCode
    304339
  • Title

    Enhanced impingement cooling using nozzles with modified exit geometries for active heat sinks

  • Author

    Marongiu, Maurice J.

  • Author_Institution
    MJM Eng. Co., Naperville, IL, USA
  • Volume
    2
  • fYear
    1996
  • fDate
    11-16 Aug 1996
  • Firstpage
    1378
  • Abstract
    Thermal management of high power electronic components with dissipation ratings of over 5 W/cm2 clearly demands high performance cooling techniques. Work, both experimental and/or analytical, is presented in this paper using enhanced impingement cooling as active heat sink for electronic component or their boards. Impinging jets (open pipes, for example) have been extensively used for high heat removal/transfer rates from surfaces. Due to its simplicity, impingement nozzles are good candidates for further performance improvements. This paper presents surface pressure and heat transfer data from two novel nozzle configurations: the nozzle with tabs and the radial nozzle. These involve simple exit geometry modifications. Results indicate that higher heat transfer rates are indeed achieved using nozzles with modified exit geometries. Typical increases in surface convective heat transfer coefficients of the order of 10-15% over plain impingement jets were recorded. Surface pressures also indicate marked reduction from those obtained using traditional nozzle exit lips
  • Keywords
    cooling; heat sinks; heat transfer; power electronics; thermal analysis; active heat sinks; cooling techniques; dissipation ratings; exit geometries modification; heat removal rate; heat transfer rate; impingement cooling enhancement; nozzle configurations; power electronic components; surface convection; surface pressure; thermal management; Electronic components; Electronics cooling; Energy management; Geometry; Heat sinks; Heat transfer; Lips; Power electronics; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3547
  • Print_ISBN
    0-7803-3547-3
  • Type

    conf

  • DOI
    10.1109/IECEC.1996.553919
  • Filename
    553919