DocumentCode :
304340
Title :
Transient response of discrete heat sources on a conducting board in the presence of cross flow mixed convection
Author :
Raghavan, Jagannath ; Rahman, Muhammad M.
Author_Institution :
Dept. of Mech. Eng., Univ. of South Florida, Tampa, FL, USA
Volume :
2
fYear :
1996
fDate :
11-16 Aug 1996
Firstpage :
1384
Abstract :
The transient response of discrete heat sources on a conducting board of finite thickness in the presence of cross flow mixed convection has been analyzed in this study. In this type of flow, the orthogonal free and forced convection result in a three dimensional boundary layer flow. A numerical model is developed to simulate the actual device considering heat generation in the integrated circuit components, conduction of heat through the board and convection of heat from board surfaces to the fluid stream. The significance of the factors that influence heat transfer rate and surface temperature of these components were analyzed. The equations for conservation of mass, momentum, and energy were solved in their time-dependent form to determine the transient evolution of velocity and temperature profiles. The numerical model identified important dimensionless parameters such as Richardson number, Reynolds number, Fourier number, Prandtl number, dimensionless source spacing, and ratio of solid to fluid thermal conductivities. A parametric study revealed their influences
Keywords :
boundary layers; forced convection; heat conduction; integrated circuits; natural convection; numerical analysis; temperature distribution; thermal analysis; thermal conductivity; transient response; Fourier number; Prandtl number; Reynolds number; Richardson number; conducting board; cross flow mixed convection; dimensionless source spacing; discrete heat sources; energy conservation; forced convection; heat generation; heat transfer rate; integrated circuit components; mass conservation; momentum conservation; numerical model; orthogonal free convection; surface temperature; temperature profile; three-dimensional boundary layer flow; transient thermal response; velocity profile; Circuit simulation; Equations; Heat transfer; Integrated circuit modeling; Numerical models; Parametric study; Solids; Temperature; Thermal conductivity; Transient response;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety
Conference_Location :
Washington, DC
ISSN :
1089-3547
Print_ISBN :
0-7803-3547-3
Type :
conf
DOI :
10.1109/IECEC.1996.553920
Filename :
553920
Link To Document :
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