• DocumentCode
    304342
  • Title

    On the role of the Knudsen number with respect to heat transfer in micro-scale flows [in microelectronics circuits]

  • Author

    Baker, J. ; Calvert, M.E. ; Power, D.J. ; Chen, E.T. ; Ramalingam, M.L. ; Lamp, T.R.

  • Author_Institution
    Dept. of Mater. & Mech. Eng., Alabama Univ., Birmingham, AL, USA
  • Volume
    2
  • fYear
    1996
  • fDate
    11-16 Aug 1996
  • Firstpage
    1396
  • Abstract
    Advances in microelectronics and in microelectromechanical systems have resulted in devices with characteristic lengths approaching that of the molecular mean free path of gases. In certain applications, it has been proposed that gaseous flows be used to cool such devices. Prior research has revealed a fundamental lack of knowledge regarding the behavior of such micro-flows. The primary dimensionless parameter associated with gaseous micro-scale transport is the Knudsen number. A critical examination of the effects of an increasing Knudsen number on heat and momentum transfer characteristics of gaseous micro-flows is presented. The importance of thermal radiation, accurate thermophysical property models, and the introduction of higher order constitutive relations, i.e. the Burnett relations, are also discussed in relation to micro-flows. Conclusions are drawn regarding the relative importance of each of the above topics
  • Keywords
    Knudsen flow; channel flow; cooling; heat radiation; integrated circuits; micromechanical devices; specific heat; thermal analysis; Burnett relations; Knudsen number; characteristic lengths; gaseous micro-scale transport; heat transfer; micro-scale flows; microelectromechanical systems; microelectronics; molecular mean free gas path; momentum transfer characteristics; primary dimensionless parameter; thermal radiation; thermophysical property models; Boundary conditions; Heat transfer; Mechanical engineering; Microelectromechanical systems; Micromechanical devices; Reflection; Temperature distribution; Thermal conductivity; Thermal stresses; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3547
  • Print_ISBN
    0-7803-3547-3
  • Type

    conf

  • DOI
    10.1109/IECEC.1996.553926
  • Filename
    553926