DocumentCode
304342
Title
On the role of the Knudsen number with respect to heat transfer in micro-scale flows [in microelectronics circuits]
Author
Baker, J. ; Calvert, M.E. ; Power, D.J. ; Chen, E.T. ; Ramalingam, M.L. ; Lamp, T.R.
Author_Institution
Dept. of Mater. & Mech. Eng., Alabama Univ., Birmingham, AL, USA
Volume
2
fYear
1996
fDate
11-16 Aug 1996
Firstpage
1396
Abstract
Advances in microelectronics and in microelectromechanical systems have resulted in devices with characteristic lengths approaching that of the molecular mean free path of gases. In certain applications, it has been proposed that gaseous flows be used to cool such devices. Prior research has revealed a fundamental lack of knowledge regarding the behavior of such micro-flows. The primary dimensionless parameter associated with gaseous micro-scale transport is the Knudsen number. A critical examination of the effects of an increasing Knudsen number on heat and momentum transfer characteristics of gaseous micro-flows is presented. The importance of thermal radiation, accurate thermophysical property models, and the introduction of higher order constitutive relations, i.e. the Burnett relations, are also discussed in relation to micro-flows. Conclusions are drawn regarding the relative importance of each of the above topics
Keywords
Knudsen flow; channel flow; cooling; heat radiation; integrated circuits; micromechanical devices; specific heat; thermal analysis; Burnett relations; Knudsen number; characteristic lengths; gaseous micro-scale transport; heat transfer; micro-scale flows; microelectromechanical systems; microelectronics; molecular mean free gas path; momentum transfer characteristics; primary dimensionless parameter; thermal radiation; thermophysical property models; Boundary conditions; Heat transfer; Mechanical engineering; Microelectromechanical systems; Micromechanical devices; Reflection; Temperature distribution; Thermal conductivity; Thermal stresses; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety
Conference_Location
Washington, DC
ISSN
1089-3547
Print_ISBN
0-7803-3547-3
Type
conf
DOI
10.1109/IECEC.1996.553926
Filename
553926
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