An innovative thermal system approach significantly increases system reliability and power and packaging densities

Author

Burns, Kathy K. ; Alexander, Ray ; Burns, James R.

Author_Institution

Therma-Spec, San Clemente, CA, USA

Volume

2

fYear

1996

fDate

11-16 Aug 1996

Firstpage

1410

Abstract

An innovative self-contained active cooling system for electronic products, which increases power and packaging densities and improves reliability, was investigated. The cooling technology uses low cost, readily available, and reliable components. While this thermal control method can be applied to many applications, a simple power system cooling application is demonstrated. The application demonstrates increased power density of a common 48 Vdc to 5 Vdc high density DC-DC power converter module having standard dimensions of 2.4"×4.6"×0.5". An increase in power density from 50 W/in ³ to over 80 W/in³ was realized. In addition, significantly higher calculated MTBF, from 300 K hours to greater than 3 M hours, was realized with low temperature operation

Keywords

DC-DC power convertors; cooling; packaging; reliability; temperature control; 0.5 in; 2.4 in; 4.6 in; 48 V; 5 V; DC-DC power converter module; electronic products; low temperature operation; packaging densities improvement; power improvement; reliability improvement; self-contained active cooling system; thermal control method; thermal system; DC-DC power converters; Electronic packaging thermal management; Electronics cooling; Fans; Multichip modules; Power system management; Power system reliability; Refrigerants; Temperature; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety

Conference_Location

Washington, DC

ISSN

1089-3547

Print_ISBN

0-7803-3547-3

Type

conf

DOI

10.1109/IECEC.1996.553928

Filename

553928