DocumentCode :
304370
Title :
A high heat flux IGBT micro exchanger setup
Author :
Meysenc, L. ; Saludjian, L. ; Bricard, A. ; Raël, S. ; Schaeffer, C. ; Wagner, D.
Author_Institution :
Lab. d´´Electrotech. de Grenoble, CNRS, St. Martin d´´Heres, France
Volume :
3
fYear :
1996
fDate :
6-10 Oct 1996
Firstpage :
1309
Abstract :
Much progress has been made over the past few years in the design of power electronic components leading to increasing development of IGBT transistors. Now IGBTs can dissipate power densities higher than 400 W/cm2 and the thermal environment has become a major factor in their behavior. The aim of this paper is to demonstrate the high performance of a silicon microchannel setup. First, a thermal study enables the theoretical behavior of the setup to be analyzed. Then an optimization method based on genetic algorithms allows the determination of the best microchannels. Finally, the theoretical results are compared with experimental measurements
Keywords :
genetic algorithms; heat exchangers; heat sinks; insulated gate bipolar transistors; power bipolar transistors; semiconductor device models; semiconductor device testing; thermal analysis; experimental measurements; genetic algorithms; heat flux; micro heat exchanger; optimization method; performance; power IBGT; power dissipation densities; silicon microchannel setup; Electrical resistance measurement; Genetic algorithms; Insulated gate bipolar transistors; Microchannel; Optimization methods; Power electronics; Silicon; Temperature; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Conference, 1996. Thirty-First IAS Annual Meeting, IAS '96., Conference Record of the 1996 IEEE
Conference_Location :
San Diego, CA
ISSN :
0197-2618
Print_ISBN :
0-7803-3544-9
Type :
conf
DOI :
10.1109/IAS.1996.559235
Filename :
559235
Link To Document :
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