• DocumentCode
    304378
  • Title

    Effect of geometrical factors on copper loss in high-frequency low-profile transformers

  • Author

    Cheng, K.W. ; Hu, Y.Q. ; He, D.H. ; Mo, W.K.

  • Author_Institution
    Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong
  • Volume
    3
  • fYear
    1996
  • fDate
    6-10 Oct 1996
  • Firstpage
    1397
  • Abstract
    The relationship between the copper loss and geometrical factors of high-frequency low-profile transformers is in investigated with the aid of finite-element method, and some practical design guidelines, which are useful for minimizing the copper loss, are presented. It has been shown that the winding geometry and arrangement are significant factors to determine the copper loss and leakage inductance; magnetic cores with lumped air-gaps can cause excessive AC loss in the windings; and windings with variable-width turns can have lower AC and DC losses than those with constant-width turns. The sandwich structure, in which the secondary is positioned between the two series-connected portions of the primary, is an effective approach to reduce the copper loss and leakage inductance. Optimal winding thicknesses are given for both the two-layered and sandwich-structured transformers
  • Keywords
    finite element analysis; high-frequency transformers; magnetic leakage; optimisation; power transformers; transformer cores; transformer windings; AC loss; HF low-profile transformers; copper loss; design guidelines; finite-element method; geometrical factors; leakage inductance; lumped air-gaps; magnetic cores; optimal winding thicknesses; sandwich structure; two-layered structure transformers; winding arrangement; winding geometry; Air gaps; Conducting materials; Copper; Inductance; Magnetic cores; Magnetic materials; Magnetosphere; Permeability; Shape control; Transformer cores;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Conference, 1996. Thirty-First IAS Annual Meeting, IAS '96., Conference Record of the 1996 IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    0197-2618
  • Print_ISBN
    0-7803-3544-9
  • Type

    conf

  • DOI
    10.1109/IAS.1996.559248
  • Filename
    559248