Title :
Development of an Optically Transparent Silicon Based Technology Platform for Biological Analysis
Author :
Davies, Nikki ; Summers, Huw D. ; Holton, Mark D. ; Brown, Martyn Rowan ; Wills, John W. ; Holland, Paul M.
Author_Institution :
Dept. of Eng., SPTS Technol. Ltd., Newport, UK
Abstract :
A prototype optical structure suitable for advanced biological investigation has been successfully manufactured using plasma-enhanced chemical vapor deposition and deep reactive-ion etching techniques. Our approach to the design and fabrication of the structure is such that it can easily be integrated onto a lab-on-a-chip cell positioning platform, combining the use of integrated circuit technology with optimal in situ analysis of cells through the substrate using high-resolution inverted microscope systems. This paper describes the concept, design, fabrication, and optical characterization of a transparent window and corresponding via, which extends from the top surface to bottom surface of a silicon wafer. The effectiveness of the platform is demonstrated in multicolor fluorescence imaging of cells, cultured on-chip, using an inverted, confocal microscope.
Keywords :
biological techniques; elemental semiconductors; fluorescence; integrated circuit technology; lab-on-a-chip; optical fabrication; optical microscopes; optical windows; plasma CVD; silicon; sputter deposition; sputter etching; Si; biological analysis; cultured on-chip; deep reactive-ion etching technique; high-resolution inverted confocal microscope system; integrated circuit technology; lab-on-a-chip cell positioning platform; multicolor fluorescence cell imaging; optically transparent silicon; plasma-enhanced chemical vapor deposition; transparent window; Optical device fabrication; Optical films; Optical imaging; Optical refraction; Optical sensors; Optical variables control; Silicon; CMOS; Dielectrophoresis (DEP); dielectrophoresis (DEP); lab-on-a- chip (LoC); lab-on-a-chip (LoC); on-chip imaging; on-chip microscopy;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2014.2367238
