Title :
Using DSP techniques to model analog IO buffers for serial links
Author :
Jain, Shubham ; Kukal, Taranjit ; Ahuja, Jasleen
Author_Institution :
Cadence Design Syst. (I) Pvt. Ltd., Noida, India
Abstract :
Data-rates for serial links like PCIe3.0, 10GKR Ethernet, and SATA, go up to several Giga-bits/second. As the transmission data rates increase, the signal strength at the receiver side decreases due to channel loss, Inter-Symbol-Interference (ISI), crosstalk, and reflections. The Input-Output (IO) buffers are, therefore, designed with inbuilt equalization circuits to recover clock and data at the receiver. In order to verify the serial link performance, one needs to simulate the PCB/Package channels with IO buffers. Capturing BER at millions of bits, requires days and weeks of simulations using standard SPICE. To accelerate this analysis, it is important to model the transistor-level IO buffers as DSP algorithms representing the equalization. This paper presents the DSP techniques used in modeling the equalization for Analog Buffers for multi-giga-bit (Gbps) serial links.
Keywords :
crosstalk; data communication; digital signal processing chips; intersymbol interference; synchronisation; BER; DSP technique; ISI; PCB; Serial Links; analog IO buffer model; channel loss; crosstalk; input-output buffer; intersymbol interference; package channel; receiver side; signal strength; standard SPICE; Adaptation models; Algorithm design and analysis; Correlation; Decision feedback equalizers; Digital signal processing; Finite impulse response filters; Simulation; BER — Bit Error Rate; DFE — Decision Feedback Equalization; EMI — Electro-Magnetic Interference; FFE — Feed Forward Equalization; FIR — Finite Impulse Response; IO — Input Output buffer; IR — Impulse Response; ISI — Inter Symbol Interference; MGH — Multi-Giga-Hertz signals; SerDes — Serial Deserial Link;
Conference_Titel :
Signal Processing and Communication (ICSC), 2015 International Conference on
Conference_Location :
Noida
Print_ISBN :
978-1-4799-6760-5
DOI :
10.1109/ICSPCom.2015.7150664