DocumentCode
3044129
Title
Low power 8T SRAM using 32nm independent gate FinFET technology
Author
Bok Kim, Young ; Yong-Bin Kim ; Lombardi, Fabrizio
Author_Institution
Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA
fYear
2008
fDate
17-20 Sept. 2008
Firstpage
247
Lastpage
250
Abstract
In this paper, new SRAM cell design methods for FinFET technology are proposed. One of the most important features of FinFET is that the independent front and back gate can be biased differently to control the current and the device threshold voltage. By controlling the back gate of FinFET, SRAM cell can be designed for minimum power consumption. This paper proposes a new 8T (8 transistors) SRAM structure that reduces dynamic power in writing operation and provides wider SNM (static noise margin). Using the new FinFET based 8T SRAM cell, dynamic power consumption is reduced about 48% and the SNM is widened up to 56% compared to the conventional 6T SRAM at the expense of 2% leakage power and 3% write delay increase.
Keywords
MOSFET; SRAM chips; low-power electronics; cell design method; current control; device threshold voltage; independent gate FinFET technology; leakage power; low power 8T SRAM; minimum power consumption; size 32 nm; static noise margin; write delay; Circuits; Design engineering; FinFETs; Inverters; MOSFETs; Power engineering and energy; Power engineering computing; Random access memory; Threshold voltage; Writing;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference, 2008 IEEE International
Conference_Location
Newport Beach, CA
Print_ISBN
978-1-4244-2596-9
Electronic_ISBN
978-1-4244-2597-6
Type
conf
DOI
10.1109/SOCC.2008.4641521
Filename
4641521
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