• DocumentCode
    3044409
  • Title

    A Highly Flexible Superhydrophobic Microlens Array with Small Contact Angle Hysteresis for Droplet-Based Microfluidics

  • Author

    Im, Maesoon ; Kim, Dong-Haan ; Huang, Xing-Jiu ; Lee, Joo-Hyung ; Yoon, Jun-Bo ; Choi, Yang-Kyu

  • Author_Institution
    Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon
  • fYear
    2009
  • fDate
    25-29 Jan. 2009
  • Firstpage
    475
  • Lastpage
    478
  • Abstract
    This paper reports a highly flexible superhydrophobic and superhydrorepellent microlens array substrate with very low flow resistance. Even though the microlens array has no nanostructures, it shows hydrophobic property due solely to its geometrical effect. A contact angle of 165deg and hysteresis of 3deg are achieved on a flexible polydimethylsiloxane (PDMS) microlens array substrate with a Teflon (polytetrafluoroethylene) coating. Moreover, double-layered metals (Cr/Au) are sandwiched between the PDMS and Teflon layers for electrostatic or electrowetting-on-dielectric (EWOD) actuation. Due to its low flow resistance and superhydrophobicity, the array can be used as a microfluidic component that reduces external pressure and power consumption for mobility.
  • Keywords
    contact angle; flexible structures; hydrophobicity; microfluidics; polymer films; wetting; Teflon coating; contact angle hysteresis; double-layered metals; droplet-based microfluidics; electrostatic actuation; electrowetting-on-dielectric actuation; flexible polydimethylsiloxane microlens array; flow resistance; highly flexible superhydrophobic microlens array; polytetrafluoroethylene; superhydrorepellent microlens array; Chromium; Coatings; Electrostatics; Energy consumption; Gold; Hysteresis; Lenses; Microfluidics; Microoptics; Nanostructures;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
  • Conference_Location
    Sorrento
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-2977-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2009.4805422
  • Filename
    4805422