Integration of Bridging-Structural SWNTs on Flexible PDMS Sheet by Stamping Transfer

Author

Takei, Yusuke ; Kan, Tetsuo ; Iwase, Eiji ; Matsumoto, Kiyoshi ; Shimoyama, Isao

Author_Institution

Univ. of Tokyo, Tokyo

fYear

2009

fDate

25-29 Jan. 2009

Firstpage

551

Lastpage

554

Abstract

This paper describes an integration method of bridging-structural single-walled carbon nanotubes (SWNTs) onto the flexible PDMS sheet by stamping transfer. Silicon microstructures and the SWNTs which directly synthesized between the gaps of the microstructures were lifted off by PDMS stamp sheets with high yield (97.8%) and accuracy (position error <100 nm). From the SEM observation of our transferred structures, we confirmed that our method could transfer the bridging-structural SWNTs on to the flexible materials without any damage to the SWNTs´ bridging.

Keywords

carbon nanotubes; elemental semiconductors; microfabrication; micromechanical devices; polymers; sheet materials; silicon; SEM; bridging-structural single-walled carbon nanotubes; flexible PDMS sheet; silicon microstructures; stamping transfer; Carbon nanotubes; Conducting materials; Conductivity; Electrical resistance measurement; Electrostatic actuators; Gold; Microstructure; Sheet materials; Silicon; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on

Conference_Location

Sorrento

ISSN

1084-6999

Print_ISBN

978-1-4244-2977-6

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2009.4805441

Filename

4805441