DocumentCode
3044950
Title
Stable and accurate trajectory control technology for the wafer transfer robot
Author
Liu, Yanjie ; Hu, Yong ; Zheng, Xiaofei
Author_Institution
State Key Lab. of Robot. & Syst., Harbin Inst. of Technol., Harbin, China
fYear
2010
fDate
20-23 June 2010
Firstpage
1336
Lastpage
1340
Abstract
During the processing of wafer, in order to avoid the friction between wafer and wafer box, and to guarantee the clean state of the working environment simultaneously, small contour error and little vibration are required for wafer transfer robot to deliver wafer, i.e., to achieve stable and accurate trajectory for wafer delivery. To lessen contour error, suppress vibration, a kind of control algorithm has been proposed in this paper combining cross-coupled synchronized control and input shaping. Via cross-coupled synchronized control, synchronization of the actuating joint can be improved and the contour accuracy can be enhanced; through the shaping of the driving impulses for the shoulder joint and the elbow joint by input shaper, the vibration at the end-effector can be reduced. Based on the experiments verified on the planar joint wafer transfer robot, it shows that the synchronizing and vibration-suppressing performance is excellent by taking advantage of the method covering both cross-coupled synchronized control and input shaping.
Keywords
industrial robots; integrated circuit manufacture; position control; stability; vibration control; contour error; control algorithm; cross coupled synchronized control; elbow joint; input shapper; shoulder joint; trajectory control technology; vibration suppression; wafer box; wafer transfer robot; Error correction; Friction; Master-slave; Robot control; Robot kinematics; Robotics and automation; Shape control; Synchronous motors; Trajectory; Vibration control; contour error; input shaping; synchronized control; vibration suppression; wafer transfer robot;
fLanguage
English
Publisher
ieee
Conference_Titel
Information and Automation (ICIA), 2010 IEEE International Conference on
Conference_Location
Harbin
Print_ISBN
978-1-4244-5701-4
Type
conf
DOI
10.1109/ICINFA.2010.5512105
Filename
5512105
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