DocumentCode :
3045232
Title :
Preparation and Thermal Characterization of Carbon Nanotubes-Based Composites for Applications in Electronics Packaging
Author :
Toschi, Francesco ; Tamburri, Emanuela ; Guglielmotti, Valeria ; Terranova, Maria Letizia ; Reale, Andrea ; Carlo, Aldo Di ; Passeri, Daniele ; Rossi, Marco ; Falessi, Carlo ; Fiorello, Annamaria ; Buttiglione, Roberta
Author_Institution :
Univ. of Rome Tor Vergata, Rome
fYear :
2008
fDate :
10-15 Feb. 2008
Firstpage :
55
Lastpage :
59
Abstract :
The thermal resistance of nanocomposite layers formed by Single Wall Carbon Nanotubes (SWCNT) dispersed in epoxy resins has been measured under conditions similar to the ones used to dissipate heat in microelectronic devices. The variation of thermal conductivity as a function of concentration of SWCNT is reported and discussed with reference to the dispersion state of SWCNT in the layers.
Keywords :
carbon nanotubes; nanocomposites; polymers; thermal conductivity; thermal management (packaging); thermal resistance; C; carbon nanotubes-based composites; electronics packaging; epoxy resins; heat dissipation; microelectronic devices; nanocomposite layers; single wall carbon nanotubes; thermal characterization; thermal conductivity; thermal resistance; Carbon nanotubes; Dispersion; Electrical resistance measurement; Electronic packaging thermal management; Electronics packaging; Epoxy resins; Nanoscale devices; Resistance heating; Thermal conductivity; Thermal resistance; Carbon Nanotubes; Epoxy Resin; Nanocomposite; TIM; Thermal Interface Materials; Thermal Management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quantum, Nano and Micro Technologies, 2008 Second International Conference on
Conference_Location :
Sainte Luce
Print_ISBN :
978-0-7695-3085-7
Type :
conf
DOI :
10.1109/ICQNM.2008.20
Filename :
4455932
Link To Document :
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