• DocumentCode
    3045562
  • Title

    Spatially Arranged Microelectrodes using Wire Bonding Technology for Spatially Distributed Chemical Information Acquision

  • Author

    Tonomura, W. ; Shimizu, K. ; Konishi, S.

  • Author_Institution
    Grad. Sch. of Sci. & Eng., Ritsumeikan Univ., Kusatsu
  • fYear
    2009
  • fDate
    25-29 Jan. 2009
  • Firstpage
    741
  • Lastpage
    744
  • Abstract
    This paper presents spatially arranged microelectrodes to allow real-time monitoring of behavior of spatially distributed chemical. Out-of-plane microelectrodes standing on a substrate with gradation in height are developed for the purpose. Wire-bonding-based probe technology makes it possible to provide spatially arranged microelectrodes. The wire-bonding-based probe technology combines wire bonding and laser machining. Bonded metal wires are converted to probe arrays by cutting the bridge. Spatially arranged microelectrodes can detect spatially distributed chemical in real time would understand various phenomena caused by spatially distributed chemical. This paper demonstrates spatially arranged microelectrodes could be used as the working electrodes of spatially electrochemical sensors in chronoamperometric measurements using K3Fe (CN)6.
  • Keywords
    carbon compounds; electrochemical sensors; iron compounds; laser beam machining; lead bonding; microelectrodes; potassium compounds; bonded metal wires; chronoamperometric measurements; laser machining; real-time monitoring; spatially arranged microelectrodes; spatially distributed chemical information acquisition; spatially electrochemical sensors; wire-bonding-based probe technology; working electrodes; Bonding; Bridges; Chemical lasers; Chemical technology; Laser beam cutting; Machining; Microelectrodes; Monitoring; Probes; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
  • Conference_Location
    Sorrento
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-2977-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2009.4805489
  • Filename
    4805489