DocumentCode
3045562
Title
Spatially Arranged Microelectrodes using Wire Bonding Technology for Spatially Distributed Chemical Information Acquision
Author
Tonomura, W. ; Shimizu, K. ; Konishi, S.
Author_Institution
Grad. Sch. of Sci. & Eng., Ritsumeikan Univ., Kusatsu
fYear
2009
fDate
25-29 Jan. 2009
Firstpage
741
Lastpage
744
Abstract
This paper presents spatially arranged microelectrodes to allow real-time monitoring of behavior of spatially distributed chemical. Out-of-plane microelectrodes standing on a substrate with gradation in height are developed for the purpose. Wire-bonding-based probe technology makes it possible to provide spatially arranged microelectrodes. The wire-bonding-based probe technology combines wire bonding and laser machining. Bonded metal wires are converted to probe arrays by cutting the bridge. Spatially arranged microelectrodes can detect spatially distributed chemical in real time would understand various phenomena caused by spatially distributed chemical. This paper demonstrates spatially arranged microelectrodes could be used as the working electrodes of spatially electrochemical sensors in chronoamperometric measurements using K3Fe (CN)6.
Keywords
carbon compounds; electrochemical sensors; iron compounds; laser beam machining; lead bonding; microelectrodes; potassium compounds; bonded metal wires; chronoamperometric measurements; laser machining; real-time monitoring; spatially arranged microelectrodes; spatially distributed chemical information acquisition; spatially electrochemical sensors; wire-bonding-based probe technology; working electrodes; Bonding; Bridges; Chemical lasers; Chemical technology; Laser beam cutting; Machining; Microelectrodes; Monitoring; Probes; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location
Sorrento
ISSN
1084-6999
Print_ISBN
978-1-4244-2977-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2009.4805489
Filename
4805489
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