• DocumentCode
    3045674
  • Title

    Performance of Packaged Piezoelectric Microspeakers Depending on the Material Properties

  • Author

    Yi, SeungHwan ; Ur, Soon Chul ; Kim, Eun Sok

  • Author_Institution
    Dept. of Mech. Eng., Chungju Nat. Univ., Chungju
  • fYear
    2009
  • fDate
    25-29 Jan. 2009
  • Firstpage
    765
  • Lastpage
    768
  • Abstract
    This paper presents the improved piezoelectric microspeakers that implement a packaging structure with AlN film and are made of composite diaphragms of different residual stresses. The output Sound Pressure Level (SPL) is enhanced more than 10 dB with a higher compressively stressed composite diaphragm (having -20 MPa silicon nitride film as a supporting layer) from 100 Hz to 3 kHz. The best microspeaker produces more than 100 dB SPL into open field around 3 kHz (when measured 10 mm away from the speaker that is driven with 20 Vpeak-to-peak sinusoidal signal). A microspeaker with a square electrode pattern produces more uniform frequency response above 4 kHz than that with a circular electrode pattern.
  • Keywords
    III-V semiconductors; audio equipment; diaphragms; electronics packaging; micromechanical devices; piezoelectric transducers; wide band gap semiconductors; AlN; SiN; composite diaphragms; electrode pattern; frequency 100 Hz to 3 kHz; packaged piezoelectric microspeaker; packaging structure; pressure 20 MPa; voltage 20 V; Electrodes; Etching; Fabrication; Film bulk acoustic resonators; Material properties; Packaging; Piezoelectric films; Residual stresses; Semiconductor films; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
  • Conference_Location
    Sorrento
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-2977-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2009.4805495
  • Filename
    4805495