DocumentCode :
3045674
Title :
Performance of Packaged Piezoelectric Microspeakers Depending on the Material Properties
Author :
Yi, SeungHwan ; Ur, Soon Chul ; Kim, Eun Sok
Author_Institution :
Dept. of Mech. Eng., Chungju Nat. Univ., Chungju
fYear :
2009
fDate :
25-29 Jan. 2009
Firstpage :
765
Lastpage :
768
Abstract :
This paper presents the improved piezoelectric microspeakers that implement a packaging structure with AlN film and are made of composite diaphragms of different residual stresses. The output Sound Pressure Level (SPL) is enhanced more than 10 dB with a higher compressively stressed composite diaphragm (having -20 MPa silicon nitride film as a supporting layer) from 100 Hz to 3 kHz. The best microspeaker produces more than 100 dB SPL into open field around 3 kHz (when measured 10 mm away from the speaker that is driven with 20 Vpeak-to-peak sinusoidal signal). A microspeaker with a square electrode pattern produces more uniform frequency response above 4 kHz than that with a circular electrode pattern.
Keywords :
III-V semiconductors; audio equipment; diaphragms; electronics packaging; micromechanical devices; piezoelectric transducers; wide band gap semiconductors; AlN; SiN; composite diaphragms; electrode pattern; frequency 100 Hz to 3 kHz; packaged piezoelectric microspeaker; packaging structure; pressure 20 MPa; voltage 20 V; Electrodes; Etching; Fabrication; Film bulk acoustic resonators; Material properties; Packaging; Piezoelectric films; Residual stresses; Semiconductor films; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location :
Sorrento
ISSN :
1084-6999
Print_ISBN :
978-1-4244-2977-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2009.4805495
Filename :
4805495
Link To Document :
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