Ball grid array assembly issues in manufacturing

Author

Rao, Srinivas T.

Author_Institution

Adv. Technol., Solectron Corp., Milpitas, CA, USA

fYear

1994

fDate

12-14 Sep 1994

Firstpage

347

Abstract

Ball Grid Array (BGA), Tape Ball Grid Array (TBGA) and other area array surface mount packages offer great advantages to the system designer in terms of performance enhancement as well as possible overall lower costs. From a volume manufacturing (in assembly) perspective there are advantages and drawbacks. Package warp, as well as the hidden interconnects are definite concerns. However there are solutions. The assembly challenges are discussed along with solutions that may be put in place in volume manufacturing. The results of an implemented robust manufacturing process are discussed along with metallurgical cross-sections. X-ray scanning beam laminograph results of good as well bad joints are presented. Results of assembled BGA cards subjected to accelerated reliability tests are also reviewed

Keywords

fine-pitch technology; integrated circuit packaging; integrated circuit reliability; microassembling; printed circuit manufacture; reflow soldering; surface mount technology; X-ray scanning beam laminograph; accelerated reliability tests; area array surface mount packages; assembly; ball grid array; robust manufacturing process; tape BGA; volume manufacturing; Assembly; Costs; Electronic mail; Electronics packaging; Inspection; Life estimation; Manufacturing processes; Robustness; Silicon; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International

Conference_Location

La Jolla, CA

Print_ISBN

0-7803-2037-9

Type

conf

DOI

10.1109/IEMT.1994.404730

Filename

404730