DocumentCode
3046402
Title
Stress and coplanarity analysis of 225 BGA package
Author
Chidambaram, N. ; Papageorge, Marc
Author_Institution
ASAT Inc., Palo Alto, CA, USA
fYear
1994
fDate
12-14 Sep 1994
Firstpage
355
Abstract
Stress and warpage analysis results of a 225 plastic Ball Grid Array (BGA) package with different design options are presented in this paper. The effect of package design parameters such as mold compound type, substrate thickness and mold corner radius are modeled and compared to measurements. Maximum stress occurs at the corner of the die and coplanarity strongly depends on mold compound and board thickness
Keywords
deformation; integrated circuit packaging; plastic packaging; stress analysis; surface mount technology; 225 BGA package; coplanarity analysis; mold compound type; mold corner radius; package design parameters; plastic ball grid array; stress analysis; substrate thickness; warpage analysis; Assembly; Copper; Electronics packaging; Geometry; Microassembly; Packaging machines; Plastic packaging; Silicon; Thermal stresses; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location
La Jolla, CA
Print_ISBN
0-7803-2037-9
Type
conf
DOI
10.1109/IEMT.1994.404732
Filename
404732
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