Title :
Development of the Novel Elongation-Measurement Device with In-Plane Bimorph Actuator for the Tensile Test
Author :
Fujii, Hiroki ; Namazu, Takahiro ; Inoue, Shozo
Author_Institution :
Dept. of Mech. & Syst. Eng., Univ. of Hyogo, Himeji
Abstract :
This paper describes novel elongation-measurement device utilized for uniaxial tensile test. The device consists of two sets of micro probes with piezoresistive sensor for detection of gauge mark position on specimen, and multiple pairs of bimorph actuators for in-plane motion to scan the gauge mark. The voltage from the sensor is put out by the cantilever deflection when the cantilevers climb the gauge marks. By Joule´s heating, movement of the bimorph actuator along one axis was achieved, and detection of gauge mark position was also realized. In the uniaxial tensile test of single-crystal silicon (SCS) film specimen, the mean Young´s modulus of 164.0 GPa was able to be measured by using the device. The measured modulus agreed with that derived from CCD-image analysis. The developed device would be useful for measuring elongation of film specimen during the uniaxial tensile test.
Keywords :
Young´s modulus; elastic moduli measurement; elemental semiconductors; elongation; piezoresistive devices; semiconductor thin films; silicon; tensile testing; CCD-image analysis; Joule´s heating; Si; Young modulus; bimorph actuators; cantilever deflection; elongation-measurement device; in-plane motion; piezoresistive sensor; single-crystal silicon film specimen; uniaxial tensile test; Actuators; Atomic measurements; Materials testing; Measurement techniques; Optical films; Piezoresistance; Probes; Semiconductor films; Silicon; System testing;
Conference_Titel :
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location :
Sorrento
Print_ISBN :
978-1-4244-2977-6
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2009.4805570