An Integrated Solution for Wafer-Level Packaging and Electrostatic Actuation of Out-of-Plane Devices

This paper presents an innovative way to integrate electrodes into our hermetic wafer-level epi-polysilicon encapsulation for out-of-plane actuated devices. The epitaxial-grown silicon encapsulation process was modified to integrate electrodes in the out-of-plane direction and realize ultra-compact packaging. The integration allows reduction of parasitic resistance by more than 180X relative to other conventional interconnects to out-of-plane electrodes. A 200 KHz "see-saw" mode resonator is demonstrated with parasitic resistance of approximately 1 Omega.