DocumentCode
3047652
Title
Electrothermal analysis of In0.12 Al0.88 N/GaN HEMTs
Author
Molnar, Miklos ; Donnarumma, G. ; Palankovski, Vassil ; Kuzmik, J. ; Donoval, Daniel ; Kovac, J. ; Selberherr, Siegfried
Author_Institution
Device Anal. Group at Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
fYear
2012
fDate
11-15 Nov. 2012
Firstpage
55
Lastpage
58
Abstract
InAlN/GaN High Electron Mobility Transistors (HEMTs) are very popular because of their promising electrical and thermal properties. With the innovation of these structures and the development of fabrication processes, there are still many serious issues like current collapse or self-heating effects, which must be addressed. In this work, the DC device behavior is studied both experimentally and by means of two-dimensional hydrodynamic device simulations. Very good agreement between measurements and simulations with Minimos-NT is achieved using the hydrodynamic transport model including self-heating and impact ionization effects.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; hydrodynamics; indium compounds; wide band gap semiconductors; 2D hydrodynamic device simulation; DC device behavior; HEMT; High Electron Mobility Transistors; In0.12Al0.88-GaN; Minimos-NT; current collapse; electrothermal analysis; hydrodynamic transport model; impact ionization effect; self heating effect; Gallium nitride; HEMTs; Hydrodynamics; Impact ionization; MODFETs; Semiconductor device measurement; Semiconductor process modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Devices & Microsystems (ASDAM), 2012 Ninth International Conference on
Conference_Location
Smolenice
Print_ISBN
978-1-4673-1197-7
Type
conf
DOI
10.1109/ASDAM.2012.6418556
Filename
6418556
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