• DocumentCode
    3047652
  • Title

    Electrothermal analysis of In0.12Al0.88N/GaN HEMTs

  • Author

    Molnar, Miklos ; Donnarumma, G. ; Palankovski, Vassil ; Kuzmik, J. ; Donoval, Daniel ; Kovac, J. ; Selberherr, Siegfried

  • Author_Institution
    Device Anal. Group at Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
  • fYear
    2012
  • fDate
    11-15 Nov. 2012
  • Firstpage
    55
  • Lastpage
    58
  • Abstract
    InAlN/GaN High Electron Mobility Transistors (HEMTs) are very popular because of their promising electrical and thermal properties. With the innovation of these structures and the development of fabrication processes, there are still many serious issues like current collapse or self-heating effects, which must be addressed. In this work, the DC device behavior is studied both experimentally and by means of two-dimensional hydrodynamic device simulations. Very good agreement between measurements and simulations with Minimos-NT is achieved using the hydrodynamic transport model including self-heating and impact ionization effects.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; hydrodynamics; indium compounds; wide band gap semiconductors; 2D hydrodynamic device simulation; DC device behavior; HEMT; High Electron Mobility Transistors; In0.12Al0.88-GaN; Minimos-NT; current collapse; electrothermal analysis; hydrodynamic transport model; impact ionization effect; self heating effect; Gallium nitride; HEMTs; Hydrodynamics; Impact ionization; MODFETs; Semiconductor device measurement; Semiconductor process modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Devices & Microsystems (ASDAM), 2012 Ninth International Conference on
  • Conference_Location
    Smolenice
  • Print_ISBN
    978-1-4673-1197-7
  • Type

    conf

  • DOI
    10.1109/ASDAM.2012.6418556
  • Filename
    6418556