DocumentCode :
3047683
Title :
Material and device issues of InAlN/GaN heterostructures
Author :
Kuzmik, J.
Author_Institution :
Inst. of Electr. Eng., Bratislava, Slovakia
fYear :
2012
fDate :
11-15 Nov. 2012
Firstpage :
45
Lastpage :
50
Abstract :
Motivation for replacing the AlGaN barrier layer of the conventional AlGaN/GaN HEMTs with lattice-matched InAlN is explained. State-of-the-art InAlN/GaN HEMTs are reviewed; emphasize is given to the analysis of the normally-off InAlN/GaN HEMTs using either a gate recessing or a concept of polarization engineering. Reliability issues of InAlN/GaN HEMTs are studied for different stress conditions and results discussed in respect to AlGaN/GaN HEMTs. Concept of InAlN/GaN/AlGaN double-heterostructure QW HEMT is shown to be more effective in blocking the hot electron injection in to the buffer. Novel InN-channel based devices are suggested with a relaxed InAlN buffer. The InN/InAlN-based HEMTs should be the choice for reaching a THz frequency range.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; indium compounds; reliability; wide band gap semiconductors; InAlN-GaN-AlGaN; barrier layer; double heterostructure QW HEMT; gate recessing; hot electron injection blocking; polarization engineering; reliability issues; Aluminum gallium nitride; Degradation; Gallium nitride; HEMTs; Logic gates; MODFETs; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Devices & Microsystems (ASDAM), 2012 Ninth International Conference on
Conference_Location :
Smolenice
Print_ISBN :
978-1-4673-1197-7
Type :
conf
DOI :
10.1109/ASDAM.2012.6418558
Filename :
6418558
Link To Document :
بازگشت