DocumentCode
3047709
Title
3-D packaging-applications of vertical multichip modules (MCM-V) for microsystems
Author
Val, Christian
Author_Institution
Thomson-CSF, Colombes, France
fYear
1994
fDate
12-14 Sep 1994
Abstract
Summary form only given. Classical 2-dimensional interconnection is compared to microtechniques using the 3rd dimension. Since 1989, several European projects with large companies including Alcatel, Daimler-Benz, Geo-Marconi, SGS Thomson, and several European universities, and Thomson-CSF have demonstrated, evaluated, and qualified the 3-D technique. The results of qualification are presented from 150 technology demonstrations plus 100 memory modules. The three-dimensional interconnection technology is presented for five application groups
Keywords
integrated circuit interconnections; integrated circuit packaging; multichip modules; 3D packaging; MCM-V; memory modules; qualification; technology demonstrations; three-dimensional interconnection technology; vertical multichip modules; Electronics packaging; Frequency; Manufacturing; Military aircraft; Multichip modules; Optical sensors; Space technology; Stacking; Teeth; Weapons;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location
La Jolla, CA
Print_ISBN
0-7803-2037-9
Type
conf
DOI
10.1109/IEMT.1994.404739
Filename
404739
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