DocumentCode
3048163
Title
Strain-temperature correlation analysis of a tied arch bridge using monitoring data
Author
Duan, Yuan-Feng ; Li, Yi ; Xiang, Yi-Qiang
Author_Institution
Coll. of Civil Eng. & Archit., Zhejiang Univ., Hangzhou, China
fYear
2011
fDate
26-28 July 2011
Firstpage
6025
Lastpage
6028
Abstract
For the reliable assessment of bridge health and safety conditions, it is important to distinguish the abnormal changes of bridge structural responses caused by structural damage from the normal changes due to environmental fluctuations. This paper addresses the modeling of separating temperature effect from structural strain responses of a tied arch bridge in China. The bridge has been instrumented with a long-term structural health monitoring system since 2007. One-year measurement data obtained from the strain and temperature sensors are used for this study. The correlation analysis technique is applied to quantify the effect of temperature on the strain responses. The results show that the linear regression model exhibits good capabilities for mapping the strain responses with temperature. Using this model, the temperature effect can be separated from the overall responses. The variation of the model parameters (variation rate and intercept) and the residual responses after removing the temperature effect can be used for novelty detection and overload alarming.
Keywords
bridges (structures); condition monitoring; regression analysis; road safety; structural engineering; China; bridge health condition assessment; bridge safety condition assessment; bridge structural response; linear regression model; separating temperature effect; strain sensor; strain-temperature correlation analysis; structural damage; structural health monitoring system; temperature sensor; Bridges; Concrete; Correlation; Monitoring; Strain; Temperature measurement; Temperature sensors; correlation analysis; health monitoring; strain; temperature; tied arch bridge;
fLanguage
English
Publisher
ieee
Conference_Titel
Multimedia Technology (ICMT), 2011 International Conference on
Conference_Location
Hangzhou
Print_ISBN
978-1-61284-771-9
Type
conf
DOI
10.1109/ICMT.2011.6002979
Filename
6002979
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