DocumentCode
3048811
Title
Study of aluminum film deposition on the surface of micro-trench by dual ion beam sputtering
Author
Tsai, Hung-Yin ; Kuo, Kei-Lin ; Wu, Chih-Wei
Author_Institution
Nat. Tsing Hua Univ., Hsinchu
fYear
2007
fDate
5-8 Nov. 2007
Firstpage
180
Lastpage
181
Abstract
In this study, dual ion beam sputtering were firstly used to deposit film on the surface of micro-trenches. Aluminum thin films were deposited on silicon substrates with micro-trenches of high aspect ratio. From the results, the dual ion beam system shows good step coverage and uniformity of film on the micro-trench.
Keywords
aluminium; ion beam assisted deposition; metallic thin films; sputter deposition; Al; Si; aluminum film deposition; dual ion beam sputtering; film uniformity; high aspect ratio microtrench; silicon substrate; Aluminum; Atomic beams; Atomic layer deposition; Automotive engineering; Ion beams; Ocean temperature; Sea surface; Semiconductor films; Sputtering; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location
Kyoto
Print_ISBN
978-4-9902472-4-9
Type
conf
DOI
10.1109/IMNC.2007.4456163
Filename
4456163
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