Fabrication of nanostencil using size reduction of micro-aperture by additional deposition

Author

Lee, J.S. ; Park, W.B. ; Park, C.W. ; Kim, G.M.

Author_Institution

Kyungpook Nat. Univ., Daegu

fYear

2007

fDate

5-8 Nov. 2007

Firstpage

190

Lastpage

191

Abstract

A low-cost method for nanostencil fabrication is demonstrated. The micro-stencils were fabricated by means of standard MEMS processes of conventional photolithography and bulk etching of Si substrate. The size of the micro-apertures was reduced down to sub-micron-meter scale by the additional deposition of SiO₂ on SiN stencil membrane. In this study, 500- mum-thick SiO₂ were deposited by PECVD from upside and downside of the stencil in order to study the size reduction of the apertures. Because the micro-aperture has a taper in the membrane of the micro-stencil due to SiN membrane etching, the deposition rate showed different with deposition direction.

Keywords

etching; micromechanical devices; nanopatterning; photolithography; plasma CVD; silicon compounds; MEMS processes; PECVD; Si; SiO₂-SiN; membrane etching; microaperture; microstencil membrane; nanopatterning; nanostencil fabrication; photolithography; size 500 mum; Apertures; Biomembranes; Costs; Etching; Internal stresses; Lithography; Micromechanical devices; Nanopatterning; Optical device fabrication; Silicon compounds;

fLanguage

English

Publisher

ieee

Conference_Titel

Microprocesses and Nanotechnology, 2007 Digest of papers

Conference_Location

Kyoto

Print_ISBN

978-4-9902472-4-9

Type

conf

DOI

10.1109/IMNC.2007.4456168

Filename

4456168