Imprinted 50 nm features by UV step and stamp imprint lithography method

Author

Haatainen, T. ; Majander, P. ; Mäkelä, T. ; Ahopelto, J.

Author_Institution

VTT Micro & Nanoelectron., Espoo

fYear

2007

fDate

5-8 Nov. 2007

Firstpage

280

Lastpage

281

Abstract

In this paper, we report on fabrication of 50 nm features by using a UV step and stamp imprint lithography method (UV SSIL), which is based on thermal SSIL using a flip chip bonder. The idea is to fabricate nanoscale patterns by pressing a small stamp, also called mould or template, into a low viscosity monomer which is then polymerized and thereby hardened (cured) by UV exposure. The mirror replicaof the pattern of the stamp is copied in the polymer. The method is developed onto a stage where a dedicated tool (NPS300) is commercially available and easily configured for both techniques.

Keywords

hardening; moulding; nanolithography; nanotechnology; polymerisation; soft lithography; ultraviolet lithography; UV SSIL; UV exposure; flip chip bonder; hardening; mould; nanoscale patterns; polymerization; size 50 nm; stamp imprint lithography method; template; thermal SSIL; viscosity monomer; Heating; Lithography; Mirrors; Nanoelectronics; Polymers; Pressing; Resists; Temperature; Thermal expansion; Viscosity; Nanoimprinting; SFIL; SSIL; step and repeat UV-NIL; step and stamp imprint lithography;

fLanguage

English

Publisher

ieee

Conference_Titel

Microprocesses and Nanotechnology, 2007 Digest of papers

Conference_Location

Kyoto

Print_ISBN

978-4-9902472-4-9

Type

conf

DOI

10.1109/IMNC.2007.4456213

Filename

4456213