DocumentCode
3049831
Title
Dependence of Mold Conditions on Demolding Force - Effects of Water Contact Angle and Pattern Shape around Top Surface
Author
Kayama, M. ; Ishihara, J. ; Kawata, H. ; Yasuda, M. ; Hirai, Y.
Author_Institution
Osaka Prefecture Univ., Osaka
fYear
2007
fDate
5-8 Nov. 2007
Firstpage
306
Lastpage
307
Abstract
In this report the friction coefficient is controlled by varying the surface treatment conditions of the mold and the press stress is controlled by changing the pattern shape of the mold. The demolding force is measured for various mold conditions. The demolding force clearly increases as the water contact angle decreases. This result shows that the friction coefficient increases dependence as the water contact angle decreases.
Keywords
contact angle; elemental semiconductors; etching; moulding; polymers; silicon; Si; demolding force; friction coefficient; mold patterns; surface treatment; water contact angle; wet etching; Chromium; Force measurement; Friction; Plasma temperature; Shape; Silicon; Sputter etching; Stress; Surface treatment; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location
Kyoto
Print_ISBN
978-4-9902472-4-9
Type
conf
DOI
10.1109/IMNC.2007.4456226
Filename
4456226
Link To Document