Title :
High density patterns fabricated in low-viscosity thermal-curable epoxy system for thermal-nanoimprint lithography
Author :
Wu, Chun-Chang ; Hsu, Steve Lien-Chung
Author_Institution :
Nat. Cheng-Kung Univ., Tainan
Abstract :
EPON828 epoxy resin crosslinked by a curing agent 954 is compatible for thermocurable nanoimprint lithography and can be used in the PET/ITO plastic substrate. The relationships between curing temperature and conversion time of the EPON828/954 epoxy resin can be obtained from DSC Isothermal Kinetics Analysis. A curing agent 954 which can cure the epoxy resin at 90degC for 10 minutes. It is suitable for low-pressure and moderate-temperature imprint process. Advantages of epoxy resist includes no solvent, good fluidity, no byproduct, low shrinkage and strong adhesion to a broad range of substrates.
Keywords :
adhesion; curing; differential scanning calorimetry; nanolithography; polymers; shrinkage; DSC; EPON828 epoxy resin; ITO; PET/ITO plastic substrate; adhesion; curing; fluidity; high density patterns; shrinkage; temperature 90 degC; thermocurable nanoimprint lithography; time 10 min; Curing; Epoxy resins; Indium tin oxide; Isothermal processes; Kinetic theory; Lithography; Nanolithography; Plastics; Positron emission tomography; Temperature;
Conference_Titel :
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location :
Kyoto
Print_ISBN :
978-4-9902472-4-9
DOI :
10.1109/IMNC.2007.4456229
