The Fabrication of Megasonic Agitated Module(MAM) for the Developed Characteristics of Wet Etching

In this paper, megasonic agitated module (MAM) has been fabricated for developing the characteristics of wet etching. Ultrasonic or megasonic waves have been widely used to remove contaminant particles from wafer during cleaning process. In this paper, the fabricated MAM has been used in wet etching process instead of ultrasonic waves. By cavitation from ultrasonic wave the wafer surface may be damaged, but in megasonic wave cavitation bubbles are not nearly formed. In addition, the boundary layer is thinner than the boundary layer by ultrasonic waves. The thinner the boundary layer is, the more efficient the removal of hydrogen bubbles on the wafer surface during etching process is. Results reveal that the fabricated MAM improves the characteristics of etching process such as etch uniformity, surface roughness and defect-free etched surface of Si or glass.