• DocumentCode
    3050744
  • Title

    Post-heat treatment effect on the dielectric response of epoxy samples

  • Author

    Frechette, M.F. ; David, E. ; Martinez, H.D. ; Savoie, S.

  • Author_Institution
    Inst. de Rech. d´´Hydro-Quebec (IREQ), Varennes, QC, Canada
  • fYear
    2009
  • fDate
    18-21 Oct. 2009
  • Firstpage
    705
  • Lastpage
    708
  • Abstract
    In the present experiment, the dielectric response of various types of epoxies was investigated in the frequency and time domain. The samples consisted of nanostructured epoxy microcomposites and reference microcomposites. Water ingression at the fabrication step and/or at measuring time is known to affect the dielectric response of materials such as epoxy. Prior to measurement, some samples were submitted to 160°C during 48 hours under vacuum. Heating the epoxy sample under vacuum was found to have a substantial effect on dielectric properties specially when the microcomposite was nanostructured. In the nanodielectric case, pre-treatment conditions could produce a drop in the dielectric constant, about 5% at around 10-2 Hz. This observation would be consistent with the removal of the polarisability associated with water molecules.
  • Keywords
    epoxy insulators; filled polymers; heat treatment; insulator contamination; nanocomposites; permittivity; polarisability; water; dielectric constant; dielectric response; epoxy samples; nanostructured epoxy microcomposites; polarisability; post-heat treatment effect; reference microcomposites; temperature 160 C; time 48 hr; water ingression; water molecules; Composite materials; Dielectric materials; Dielectric measurements; Electrochemical impedance spectroscopy; Electrodes; Frequency measurement; Polarization; Polymers; Time domain analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2009. CEIDP '09. IEEE Conference on
  • Conference_Location
    Virginia Beach, VA
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4244-4557-8
  • Electronic_ISBN
    0084-9162
  • Type

    conf

  • DOI
    10.1109/CEIDP.2009.5377749
  • Filename
    5377749