Dynamic variation of internal stress distribution in the curing process of epoxy resin, using high sensitive birefringence measurement system

Author

Yamagishi, Shigekazu ; Sekine, Yasuhiro ; Zhu, Yongchang ; Takada, Tatsuo

Author_Institution

Electron. Meas. Lab., Musashi Inst. of Technol., Tokyo, Japan

Volume

1

fYear

1996

fDate

20-23 Oct 1996

Firstpage

82

Abstract

Dynamic variation of the internal stress distribution in the curing process of epoxy resin is measured for 20 hours immediately after the resin is put into a casting model by using a highly sensitive birefringence measurement system. The direction of the internal stress near the wall of the test cell is parallel to the radial direction, while that around the center is perpendicular to the radial direction. The internal stress with direction parallel to the radial direction results from tensile stress, while that with direction perpendicular to the radial direction results from compressive stress

Keywords

casting; epoxy insulation; internal stresses; materials preparation; mechanical birefringence; stress measurement; 0 to 20 hour; casting model; compressive stress; curing process; dynamic variation; epoxy resin; highly sensitive birefringence measurement system; internal stress direction; internal stress distribution; molded insulation; radial direction; tensile stress; Birefringence; Casting; Curing; Dielectrics and electrical insulation; Electric variables measurement; Epoxy resins; Internal stresses; Optical modulation; Phase measurement; Stress measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation and Dielectric Phenomena, 1996., IEEE 1996 Annual Report of the Conference on

Conference_Location

Millbrae, CA

Print_ISBN

0-7803-3580-5

Type

conf

DOI

10.1109/CEIDP.1996.564598

Filename

564598