DocumentCode
3051399
Title
Dielectric properties of polypropylene loaded with synthetic organoclay
Author
Bulinski, A. ; Bamji, S.S. ; Abou-Dakka, M. ; Chen, Y.
Author_Institution
Inst. for Nat. Meas. Stand., Nat. Res. Council of Canada, Ottawa, ON, Canada
fYear
2009
fDate
18-21 Oct. 2009
Firstpage
666
Lastpage
671
Abstract
The incorporation of synthetic silica nanoparticles into polypropylene is shown to increase the ac breakdown strength compared to unfilled material. This breakdown strength stays unchanged during application of a 40 kV/mm dc field for up to 500 h at both, room temperature and 90°C. Dielectric spectroscopy shows an increase of dielectric loss factor, tan¿, with nanoflller concentration and a distinct relaxation around 60°C. The increase of tan¿ caused by nanoparticles is moderate and thus manageable in practical applications. Subjecting specimens to a dc field did not significantly change the dielectric loss spectra. The dc conductivity of the materials with nano-filler was found to be higher than for unfilled materials. This is believed to be caused by the overlapping of the diffuse double layers surrounding nanoparticles, which provide a path for the migration of electric charge. Aging nanocomposites in a dc field resulted in the increase of conductivity but the increments were significantly smaller than those observed in the material without organoclay.
Keywords
ageing; dielectric losses; dielectric relaxation; diffusion; electric breakdown; electric strength; electrical conductivity; filled polymers; nanocomposites; nanoparticles; silicon compounds; SiO2; ac breakdown strength; aging; dc conductivity; dielectric loss factor; dielectric loss spectra; dielectric spectroscopy; diffuse double layers; distinct relaxation; electric charge migration; nanocomposites; nanoflller concentration; polypropylene; synthetic organoclay; synthetic silica nanoparticles; temperature 293 K to 298 K; temperature 90 degC; time 500 h; Conducting materials; Conductivity; Dielectric losses; Dielectric materials; Electric breakdown; Electrochemical impedance spectroscopy; Nanoparticles; Nanostructured materials; Silicon compounds; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2009. CEIDP '09. IEEE Conference on
Conference_Location
Virginia Beach, VA
ISSN
0084-9162
Print_ISBN
978-1-4244-4557-8
Electronic_ISBN
0084-9162
Type
conf
DOI
10.1109/CEIDP.2009.5377780
Filename
5377780
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