• DocumentCode
    3051852
  • Title

    Wireless power transmission for implantable devices using inductive component of closed-magnetic circuit structure

  • Author

    Jung, Kihyun ; Kim, Yong-Ho ; Choi, Euy ; Kim, Hyun ; Yong-Jun Kim

  • Author_Institution
    Mech. Eng. Dept., Yonsei Univ., Seoul
  • fYear
    2008
  • fDate
    20-22 Aug. 2008
  • Firstpage
    272
  • Lastpage
    277
  • Abstract
    An integrated flexible inductor is realized for wireless transcutaneous power transmission to implantable devices. Our method uses a mechanically flexible inductor which can be less invasively implanted in, or more easily attached to, the human body. The inductor pair is used for wireless power transmission. The primary inductor is attached on the patientpsilas skin and the secondary inductor is implanted under the subcutaneous tissue. The transmission efficiency depends on the induced magnetic flux on the secondary inductor. In order to achieve a closed magnetic circuit, a core material composed of 81% nickel and 19 % iron is used for concentrating a magnetic flux which is generated on the primary inductor and transmitted to the secondary inductor. Three kinds of flexible inductors were fabricated using flexible printed circuit board (FPCB) fabrication technologies. Transmission efficiency of each inductor was measured using a function generator and an oscilloscope.
  • Keywords
    inductors; magnetic circuits; magnetic flux; prosthetic power supplies; closed-magnetic circuit structure; flexible printed circuit board fabrication technologies; function generator; implantable devices; induced magnetic flux; inductive component; mechanically flexible inductor; oscilloscope; wireless transcutaneous power transmission; Biological materials; Humans; Inductors; Magnetic circuits; Magnetic cores; Magnetic flux; Magnetic materials; Nickel; Power transmission; Skin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multisensor Fusion and Integration for Intelligent Systems, 2008. MFI 2008. IEEE International Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-2143-5
  • Electronic_ISBN
    978-1-4244-2144-2
  • Type

    conf

  • DOI
    10.1109/MFI.2008.4648077
  • Filename
    4648077