• DocumentCode
    3051920
  • Title

    Implant isolation study of In0.53Ga0.47As

  • Author

    Almonte, M. ; Yu, K.M. ; Haller, E.E. ; Ridgway, M.C. ; Hou, H. ; Mirecki-Millunchick, J.

  • fYear
    1998
  • fDate
    1998
  • Firstpage
    29
  • Lastpage
    32
  • Abstract
    Effects of implantation in In0.53Ga0.47As due to damage by implantation of Ne+ ions and to compensation by implantation of Fe+ ions are reported. The former only involves damage induced effects while the latter leads to damage and dopant induced compensation. In addition, the changes in the electrical properties of the layers are correlated to the lattice damage (damage induced effects) and/or the diffusion of the compensating dopants (dopant induced compensation). Structural characterization of the layers is performed with channeling Rutherford Backscattering Spectrometry (RBS). The distribution of the compensating dopants in the as-implanted and annealed layers is examined by Secondary Ion Mass Spectrometry (SIMS). The thermal stability of these damage and compensation induced effects producing implant isolation is discussed
  • Keywords
    III-V semiconductors; Rutherford backscattering; channelling; diffusion; gallium arsenide; indium compounds; ion implantation; secondary ion mass spectra; thermal stability; In0.53Ga0.47As:Fe; In0.53Ga0.47As:Ne; SIMS; channeling Rutherford backscattering; compensation; diffusion; implant isolation; ion implantation; lattice damage; thermal stability; Backscatter; Conductivity; Implants; Indium phosphide; Iron; Lattices; Mass spectroscopy; Rapid thermal annealing; Semiconductor materials; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconducting and Insulating Materials, 1998. (SIMC-X) Proceedings of the 10th Conference on
  • Conference_Location
    Berkeley, CA
  • Print_ISBN
    0-7803-4354-9
  • Type

    conf

  • DOI
    10.1109/SIM.1998.785070
  • Filename
    785070