• DocumentCode
    3051978
  • Title

    Partial discharge measurements for spherical cavities within solid dielectric materials under different stress and cavity conditions

  • Author

    Illias, H.A. ; Chen, G. ; Lewin, P.L.

  • Author_Institution
    Sch. of Electron. & Comput. Sci., Univ. of Southampton, Southampton, UK
  • fYear
    2009
  • fDate
    18-21 Oct. 2009
  • Firstpage
    388
  • Lastpage
    391
  • Abstract
    The measurement of partial discharge is used in the performance assessment of insulation systems of high voltage components. This paper describes the development of a test object consisting of a single spherical cavity within a dielectric material. The test object is used to experimentally study the effect of variable applied frequency, applied voltage magnitude and size on PD activity. The obtained measurement data are analyzed and presented. The variations in the measurement results can be interpreted as changes in cavity parameters that can be used for PD modeling. The obtained data gives more information on how PD activity behaves under different stress conditions and the cavity conditions.
  • Keywords
    dielectric materials; epoxy insulation; epoxy insulators; insulation testing; partial discharge measurement; plasma diagnostics; stress effects; voids (solid); cavity parameters; discharge frequency; discharge voltage; epoxy resin; high voltage component insulation system assessment; partial discharge activity; partial discharge measurement; partial discharge modeling; solid dielectric material; spherical cavity; stress effect; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Frequency; Materials testing; Partial discharge measurement; Partial discharges; Solids; Stress; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2009. CEIDP '09. IEEE Conference on
  • Conference_Location
    Virginia Beach, VA
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4244-4557-8
  • Electronic_ISBN
    0084-9162
  • Type

    conf

  • DOI
    10.1109/CEIDP.2009.5377831
  • Filename
    5377831