• DocumentCode
    3052042
  • Title

    Hybrid metal-insulator plasmonic slab directional coupler

  • Author

    Noghani, Mahmoud T. ; Samiei, Mohammad H. Vadjed

  • Author_Institution
    Sch. of Electr. Eng., Iran Univ. of Sci. & Technol., Tehran, Iran
  • fYear
    2013
  • fDate
    14-16 May 2013
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A new two-dimensional plasmonic directional coupler is proposed based on the hybrid metal-insulator slab waveguide (HMISW). It is analyzed using the super mode theory (SMT) based on solving the symmetrical and antisymmetrical modes with the aim of transfer matrix method (TMM). The hybrid slab waveguide is composed of a metallic layer of silver and two dielectric layers of silica (SiO2) and silicon (Si). Analysis is performed at the telecommunication wavelength of 1550 nm. Optimization of the coupling length according to layer thicknesses is mainly considered. Maximum transferred power (Pmax) and the spatial extent of the coupler (Ls) are calculated as two additional performance criteria. It is shown that coupling lengths as low as 0.5 μm could be achieved resulting in a coupler much smaller than conventional directional couplers. In this case, percentage of transferred power is 90, coupler thickness is about 200 nm and the spatial length is 700 nm.
  • Keywords
    dielectric materials; elemental semiconductors; metal-insulator boundaries; optical directional couplers; optical waveguides; plasmonics; silicon; silicon compounds; silver; Ag-SiO2-Si; HMISW; SMT; TMM; antisymmetrical mode; coupler thickness; coupling length; dielectric layers; hybrid metal-insulator plasmonic slab directional coupler; hybrid metal-insulator slab waveguide; layer thicknesses; maximum transferred power; metallic layer; optimization; silica; spatial length; super mode theory; symmetrical mode; telecommunication wavelength; transfer matrix method; two-dimensional plasmonic directional coupler; wavelength 1550 nm; Couplings; Directional couplers; Metals; Optical waveguides; Plasmons;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Engineering (ICEE), 2013 21st Iranian Conference on
  • Conference_Location
    Mashhad
  • Type

    conf

  • DOI
    10.1109/IranianCEE.2013.6599893
  • Filename
    6599893