Die for MCMs: IC preparation for testing, analysis and assembly

A method of die preparation for test, analysis and burn-in is described that can begin to address multichip module (MCM) infrastructure requirements for obtaining known good die. The process developed provides full functional component testing, timing analysis at speed, and burn-in of ICs prior to MCM insertion. A soluble polymer overlay was coated on the die surface and patterned with new top level metal bond pads, allowing standard packaging, testing and burn-in while permitting a method of recovering selected devices for use in an MCM. The overlay formed a protective coating for the die and if left in place may be used to support assembly specific metallization patterns and various metal finish types. A demonstration of this technique is reported and the component quality and analysis effort is described